| 摘要 |
PROBLEM TO BE SOLVED: To provide titanium-copper having excellent plating adhesion. SOLUTION: The titanium-copper having excellent plating adhesion can be obtained by adding, by mass, 25 to 500 ppm Al to a copper alloy having a composition comprising 1.0 to 4.5% Ti, and the balance Cu with inevitable impurities. By regulating the Al concentration in the surface of the titanium-copper to 0.05 to 1.0%, its plating adhesion further improves. The titanium-copper may comprise one or more kinds selected from Fe, Sn, Ni, Ag, Mn, Zn and Cr by≤0.3% in total. COPYRIGHT: (C)2008,JPO&INPIT
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