| 摘要 |
PROBLEM TO BE SOLVED: To provide solder plating which is excellent in solder wettability and is in high connection reliability even for solder connection of minute portions. SOLUTION: The plating contains a compound having flux activity in an alloy including tin or at least one metal selected from the group consisting of lead, zinc, bismuth, antimony, indium, gold, silver, copper, and nickel in the tin. Also, the above compound having the flux activity has at least one or more of carboxylic groups and phenolic hydroxyl groups in the molecule and further, the compound having the flux activity contains 5 to 30% in the plating film. COPYRIGHT: (C)2008,JPO&INPIT
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