发明名称 HEAT RESISTANT RESIN COMPOSITION, PREPREG AND LAMINATED BOARD MADE BY USING IT
摘要 PROBLEM TO BE SOLVED: To provide a resin composition superior in heat resistance, dielectric characteristics and the coefficient of water absorption, and a prepreg and a laminate made from the prepreg. SOLUTION: The heat resistant resin composition comprises a cyanate resin, an aralkyl-modified epoxy resin and an aralkyl resin as an essential component. A biphenyl aralkyl epoxy resin or a phenol aralkyl modified epoxy resin is preferred as the aralkyl modified epoxy resin. A biphenyl aralkyl resin or a phenol aralkyl is preferred as the aralkyl resin. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007254746(A) 申请公布日期 2007.10.04
申请号 JP20070080852 申请日期 2007.03.27
申请人 SUMITOMO BAKELITE CO LTD 发明人 TOBISAWA AKIHIKO
分类号 C08L79/00;B32B27/38;C08G73/08;C08J5/24;C08L63/00;C08L65/00 主分类号 C08L79/00
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