| 摘要 |
The present invention provides a design support device for a semiconductor device, etc. which can significantly reduce processing steps required in constructing power source wiring patterns and can perform processing at a high speed using a small amount of resources by making conventional bump cells include global power source wiring of meshed configuration. The design support device includes a wiring block acquisition unit that acquires predetermined wiring blocks as data from a plurality of wiring blocks whose wiring pattern structures formed in the insides of the respective wiring blocks in the layer thickness direction thereof are different from each other, the plural wiring blocks being used to form power source wiring layers of a plurality of layers of the semiconductor device, and a power source wiring unit that forms predetermined power source wiring layers of a plurality of layers of the semiconductor device using data by combining wiring blocks acquired by the wiring block acquisition unit.
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