发明名称 Method of Three-Dimensional Microfabrication and High-Density Three-Dimensional Fine Structure
摘要 Surface of a thin film formed on a surface of substrate of Al<SUB>x</SUB>Ga<SUB>y</SUB>In<SUB>1-x-y</SUB>As<SUB>z</SUB>P<SUB>1-z </SUB>(0<=x<1, 0<=y and z<=1) including substances GaAs and InP is irradiated with electron beams controlled at any arbitrary electron beam diameter and current density so as to cause any natural oxide film formed on GaAs surface to undergo selective Ga<SUB>2</SUB>O<SUB>3 </SUB>substitution or formation. Thereafter, the temperature of the substrate is adjusted to given temperature so as to effect detachment of the natural oxide film at region other than that of Ga<SUB>2</SUB>O<SUB>3 </SUB>substitution. Selective growth of a Group III-V compound semiconductor crystal is carried out on the substrate on its side of natural oxide film detachment in accordance with the molecular beam epitaxial growing technique to thereby achieve an increase of substrate density. On-site formation of a circuit pattern having the crystal film thickness along the direction of crystal growth uniformalized on the order of nanometers is accomplished.
申请公布号 US2007232029(A1) 申请公布日期 2007.10.04
申请号 US20040578034 申请日期 2004.04.13
申请人 KANEKO TADAAKI;SANO NAOKATSU;SAKAUE KIYOSHI 发明人 KANEKO TADAAKI;SANO NAOKATSU;SAKAUE KIYOSHI
分类号 H01L21/20;H01L21/203;H01S5/34 主分类号 H01L21/20
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