| 摘要 |
A heat sink device which is used to bond to a stand-alone blade server for dissipating heat produced by the stand-alone blade server is provided. The heat sink device comprises a cabinet having a bonding end and a mounting end opposed to the bonding end, and a fan structure setting in the mounting end of the cabinet. The bonding end is bonded to the stand-alone blade server, and the fan structure is used to dissipate heat produced by the stand-alone blade server to the air through a crossover passage formed between the bonding end and the mounting end, such that the heat produced by the stand-alone blade server can be dissipated effectively.
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