SEMICONDUCTOR DEVICE WITH SOLDERABLE LOOP CONTACTS
摘要
A method of easily manufacturing reliable solder contacts on semiconductor dies are made in the shape of a loop made from metal wires or ribbons that may be coated with other solderable metals. The loops can be in multi loop form, single loop form, or both on the semiconductor die. The loop contacts may be formed on the die using thermosonic or ultrasonic bonding. The die may also be packaged with encapsulating material leaving the die exposed through the encapsulating material as a solder-ready contact for the device.
申请公布号
WO2007112393(A2)
申请公布日期
2007.10.04
申请号
WO2007US65025
申请日期
2007.03.27
申请人
FAIRCHILD SEMICONDUCTOR CORPORATION;LEE, SANGDO;RIOS, MARGIE, T.