METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board in which a wiring pattern can be made finer, and to provide such a wiring board.

SOLUTION: The method comprises a step for applying a resist 17 on a metal plate 16 and patterning the applied resist; a step for using the applied resist as a mask and forming a laminated metal layer 22 on the metal plate; a step for forming a conductive bump 12a on the formed lamination metal layer; a step for forming an integrated material by arranging an insulating board 13 with thermal plasticity and thermosetting property so as to face the surface in which the conductive bump exists and laminating and pressurizing so that the conductive bump penetrates the insulating board to expose its head; a step for forming an integrated double-sided wiring board by arranging a metal foil opposed to the side of the insulating board of the integrated material, and laminating and pressurizing, and heating; and a step for etching a part of the metal foil of the double-sided wiring board.

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