| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer holding pad capable of sucking and holding a wafer on which an annular reinforcing portion is provided and a concave portion is formed on the outer peripheral portion, without causing breakage of the wafer. SOLUTION: The wafer holding mechanism is provided with at least three holding members for holding the outer peripheral portion of the wafer; a supporting plate provided with a guiding section for guiding the at least three holding members in a radiation direction and movably supporting the wafer along the guiding member; and a moving means for moving the at least three holding members along the guiding section. COPYRIGHT: (C)2008,JPO&INPIT |
