| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor cooling apparatus which can attain improvement in cooling efficiency and cooling medium accuracy and can attain small-sizing and reduction of costs without decreasing the flow rate of a cooling medium circulating within a cooling medium passage. SOLUTION: The semiconductor cooling apparatus 1 cools a semiconductor device (device 2) mounted on a mounting face 3 of a heat radiator (cooler 4) using a cooling medium (cooling water 6) circulating within a cooling medium passage 5 provided in the cooler 4. The semiconductor cooling apparatus 1 comprises: a current deflecting means (valve mechanism 10) provided within the cooling medium passage 5 and including a plate-like current deflecting member (valve plate 11) for deflecting the current of the cooling water 6 toward a portion near the device 2 on a heat conducting face 7 of the cooler 4 in contact with the cooling water 6; a driving means for driving the valve plate 11 so as to change the flow rate of the cooling water 6 to be deflected; a temperature detecting means for detecting the temperature of the device 2 or the temperature near the device 2; and a control means for controlling the drive of the valve plate 11 due to the driving means based on the temperature detected by the temperature detecting means. COPYRIGHT: (C)2008,JPO&INPIT |
