| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor apparatus wherein a stable operation is achieved by suppressing local heat production. SOLUTION: This semiconductor apparatus joins a semiconductor substrate 10 having a semiconductor device formed on the surface thereof, and a lower mounting substrate 14 on which the semiconductor substrate 10 is mounted. The apparatus comprises a pressing member 18 for imposing a load on the surface side of the semiconductor substrate 10, and can solve the problem by pressing the periphery of the semiconductor device with the pressing member 18. COPYRIGHT: (C)2008,JPO&INPIT |
