| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To manufacture a wiring board having a built-in ceramic chip having a connection reliability with a semiconductor element by improving the planarity of a built-up layer for mounting the semiconductor element. <P>SOLUTION: A core material 11 of this wiring board 10 has a housing hole 91 opened on a core first main surface 12 and a core second main surface 13. A ceramic capacitor 101 is housed in the housing hole 91 in a state where a chip first main surface 102 faces the same side as the first main surface 12 and a chip second main surface 103 faces the same side as the core second main surface 13. A gap 93 between an internal surface 92 of the housing hole 91 and a side surface 106 of the ceramic capacitor 101 is filled with a resin filler agent 95, and the ceramic capacitor 101 is fixed on the core material 11. A build-up layer 31 for mounting an IC chip 21 is formed on the chip first main surface 102 and the core first main surface 12 which have the good planarity. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
