发明名称 FLEXIBLE PRINTED-WIRING BOARD AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a flexible wiring board having an excellent reflow resistance (a heat resistance against a reflow), and a manufacturing method for the flexible wiring board. SOLUTION: The flexible printed-wiring board 1 has a first flexible printed-wiring board 2 with a first connecting wiring 6 fitted on a first base material 4, and a second flexible printed wiring board 3 with a second connecting wiring 14 fitted on a second base material 11. An anisotropic conductive adhesive containing conductive fine grains 24 is used as an adhesive layer 5, and the conductive fine grains 24 have a spicular shape or a shape with a large number of fine grains connected in a straight chain shape. When the flapping heights of the first and second connecting sets of wiring 6 and 14 are represented by W, and the heights of conductor wirings 25 and 26 constituting the first and second connecting sets of wiring 6 and 14 by H; the flexible printed-wiring board has the relationship of W≤0.75H. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007258421(A) 申请公布日期 2007.10.04
申请号 JP20060080400 申请日期 2006.03.23
申请人 SUMITOMO ELECTRIC IND LTD;SUMITOMO ELECTRIC PRINTED CIRCUIT INC 发明人 KASHIWABARA HIDEKI;KOYAMA KEIJI;NAKAYAMA SHUICHI
分类号 H05K1/14 主分类号 H05K1/14
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