发明名称 SUBSTRATE DRYING APPARATUS, SUBSTRATE DRYING METHOD, AND SUBSTRATE MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To uniformly drying both sides of a substrate with no unevenness using air knives symmetrically provided at upper and lower sides of the substrate via the substrate. SOLUTION: The air knives 20a, 20b symmetrically provided at upper and lower sides of the substrate 1 via the substrate 1 have a width longer than a width in the direction orthogonal to the moving direction of the substrate 1. A flow straightening plate 30 to which air blown out of the air knives 20a, 20b impinges is provided at a position separated from the width in the direction orthogonal to the moving direction of the substrate 1, and the impinging height of air blown out of the air knives 20a, 20b is kept at the height of the flow straightening plate 30, when the air blown out of the air knives 20a, 20b does not directly impinges on the substrate 1. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007252984(A) 申请公布日期 2007.10.04
申请号 JP20060077430 申请日期 2006.03.20
申请人 HITACHI HIGH-TECHNOLOGIES CORP 发明人 MORIGUCHI YOSHIHIRO;IZAKI MAKOTO
分类号 B08B5/00;G02F1/13 主分类号 B08B5/00
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