发明名称 Method for producing metal/ceramic bonding substrate
摘要 After a molten metal of aluminum or an aluminum alloy having a temperature, which is higher than the liquidus line temperature of aluminum or the aluminum alloy by 5 to 200° C., is injected into a mold, when the mold is cooled to solidify the molten metal, the molten metal injected into the mold is pressurized at a pressure of 1.0 to 100 kPa from a high-temperature side to a low-temperature side, and the mean cooling rate is set to be 5 to 100° C./minute while the mold is cooled from the liquidus line temperature to 450° C., the temperature gradient formed in the mold being set to be in the range of from 1° C./cm to 50° C./cm.
申请公布号 US2007227685(A1) 申请公布日期 2007.10.04
申请号 US20070729221 申请日期 2007.03.28
申请人 DOWA METALTECH CO., LTD. 发明人 SUGAWARA AKIRA;TAKAHASHI TAKAYUKI
分类号 B22D19/04;B22D27/04;B22D27/09 主分类号 B22D19/04
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