发明名称 LAMINATED ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To provide a laminated electronic component which can be baked in a reductive atmosphere, has excellent DC bias characteristics, has decreased electrostriction quantity, has capacitive temperature characteristics satisfying X6S characteristics of EIA standards, and further, has high relative permittivity, and to provide a manufacturing method thereof. <P>SOLUTION: The laminated electronic component has a configuration of alternately laminating a dielectric layer consisting of a dielectric porcelain composition in which BaTiO<SB>3</SB>, SrTiO<SB>3</SB>and CaTiO<SB>3</SB>are contained as main components, these BaTiO<SB>3</SB>, SrTiO<SB>3</SB>and CaTiO<SB>3</SB>do not substantially form a solid solution with each other but form a composite structure; and an internal electrode layer. In the manufacturing method of the laminated electronic component, an electrode paste containing a conductive powder and a co-material containing a BaTiO<SB>3</SB>powder, an SrTiO<SB>3</SB>powder and a CaTiO<SB>3</SB>powder, and having the content of BaTiO<SB>3</SB>set at a specific range is used as an electrode paste for forming an electrode paste film to be used as an internal electrode after baking. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007258476(A) 申请公布日期 2007.10.04
申请号 JP20060081417 申请日期 2006.03.23
申请人 TDK CORP 发明人 TAKANO HIROSUKE;MIYAUCHI MARI;SATO AKIRA
分类号 H01G4/12;C04B35/00;C04B35/46;C04B35/622;H01G4/30 主分类号 H01G4/12
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