| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide electronic component mounting device and method which can enhance productivity by reducing the frequency of a work required when the type of the component is switched. <P>SOLUTION: The component mounting work for takes out the chips of component types A, B and C from a component feeder by means of a single mounting head, and mounts them on two sheets of substrate held on first and second lanes. If such a state as the component mounting operation of a subsequent substrate can be performed before completing the mounting process of a preceding substrate is brought about in the process performing the component mounting operation of the preceding substrate among a plurality of substrates, following substrate mounting process is started at that timing for the objective chip of the component mounting operation onto the preceding substrate as a mounting start component, thus continuing the not-yet-completed preceding substrate mounting process. Consequently, the frequency of a work required can be reduced when the type of component is switched. <P>COPYRIGHT: (C)2008,JPO&INPIT |
