| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a piezoelectric device which is down-sized and excellent in drive level characteristics and in which residual stress is not generated in a joining part of a package and characteristic deterioration factors are eliminated. <P>SOLUTION: In the piezoelectric device including a base 54, a frame attached resonator chip 55 laminated and fixed to the base, and a lid 56 laminated and fixed to the frame attached resonator chip, the base, the frame attached resonator chip, and the lid are made of entirely the same materials or materials whose linear expansion coefficients are extremely close to one another, and they are vacuum-locked by joining their joining faces by surface active joining. <P>COPYRIGHT: (C)2008,JPO&INPIT |
