| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a piezoelectric device which is down-sized and excellent in drive level characteristics and in which residual stress is not generated in a joining part of a package and characteristic deterioration factors are eliminated. <P>SOLUTION: The piezoelectric device including a base 54, a frame attached resonator chip 55, and a lid 56 laminated and fixed to the frame attached resonator chip is configured such that the base, the frame attached resonator chip, and the lid are made of entirely the same materials, the frame attached resonator chip 55 includes a resonator chip body 32 and a frame 53, joining faces of the base, the frame attached resonator chip, and the lid are joined by surface active joining and vacuum-locked, electrodes for driving the resonator chip body 32 are extended to a frame as lead-out electrodes, and the lead-out electrodes of the frame are electrically connected to mount electrodes as external terminals provided to the base via a conductive pattern formed on the joining face of the base by the joining. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
