| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and its manufacturing method capable of preventing the semiconductor device and a mounting substrate from making contact with each other, even when face-down mounting the semiconductor device. SOLUTION: The semiconductor device is prevented from making contact with a mounting substrate when flip-chip mounting the semiconductor device by forming any one or their combination of a step difference, an inclination, and a step. Further, no use of a spacer prevents mounting reliability from being lowered. COPYRIGHT: (C)2008,JPO&INPIT
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