| 摘要 |
PROBLEM TO BE SOLVED: To provide an individual substrate manufactured from an assembled substrate that cannot be divided by mistake during the treatment of the assembled substrate, and can be divided easily when needed. SOLUTION: The individual substrate 20 used as an SMD, or the like is manufactured from the assembled substrate 2 that has a substrate region 4 that becomes a plurality of individual substrates 2 after division, and has a dummy region 6 to be abolished while a terminal electrode 24 is formed on the back of each individual substrate 20. In the substrate region 4, a plurality of first divided grooves 8a, 8b having first depth are extended to the middle of a dummy region 6, and are not extended to the side edge of the assembled substrate 2. The grooves are formed to 10-90% depth to the thickness of the assembled substrate 2 with first 8-12N force by a grooving apparatus 40 by partitioning the individual substrate 20. In the dummy region 6, a second divided groove 10 having second depth that is shallower than the first depth is formed with 5-50% depth to the thickness of the assembled substrate 2 with second 6-10N force by the grooving apparatus 40, so that it is extended to the side edge of the assembled substrate 2. COPYRIGHT: (C)2008,JPO&INPIT
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