| 摘要 |
PROBLEM TO BE SOLVED: To automatically shape the existing wiring designed on a substrate surface of a semiconductor package in an optional direction into a wiring having a particular angle with respect to a predetermined reference line. SOLUTION: This automatic wiring shaping device 1 is provided with a setting means 11 for setting an equiangular octagon which circumscribes a cycle showing a position for ensuring clearance to vias so as to make one side of the equiangular octagon parallel to a reference line, a setting means 12 for setting an equiangular octagon which has the center at a central position of a via close to a segment line with respect to the existing wiring having a segment line going through between vias and circumscribes a circle coming into contact with the segment line so as to make one side of the equiangular octagon parallel to the reference line, a correcting means 13 for correcting the existing wiring located near a via so as to make the wiring overlap on any side of the equiangular octagon set with respect to the via, and a correcting means 14 for connecting two segment lines obtained by the correcting means 13 by a segment line in the direction of 45×n degrees (n is integer) with respect to the reference line. COPYRIGHT: (C)2008,JPO&INPIT |
