| 摘要 |
A method of manufacturing an electronic component which can reduce voids in a solder and can reliably melt the solder is provided. The method of manufacturing an electronic component including a member (substrate 1 ) having a metal junction (electrode 11 ) includes: the step of supplying a solder 5 containing a solvent, a resin component, an activator, and a brazing filler metal to the junction (electrode 11 ); the first heating step in which a first heating process to the solder 5 is performed and the solder 5 is kept at a first heating temperature for a predetermined period of time; the second heating step in which a second heating process to the solder 5 is preformed and the solder 5 is kept at a second heating temperature higher than the first heating temperature for a predetermined period of time to vaporize the solvent and the resin component; and the third heating step in which a third heating process to the solder 5 is performed and the solder 5 is melted.
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