| 摘要 |
Resin compositions which contain compounds having structures represented by the general formula (1) and which can be converted by heat treatment into ones having high heat resistance and low permittivity; varnishes containing the same; and semiconductor devices made by using the varnishes: (1) wherein Ar is an aromatic group; a is 0 or 1; R 11's are each an organic group having one or more carbon atoms and at least one of R11's is a group having an alicyclic structure; when q is an integer of 2 or above, R11's may be the same or different from each other; at least one of R1 to R5 and at least one of R6 to R10 are Ar-or R 11-combining sites of their respective benzene rings and the others are each hydrogen, a group having an alicyclic structure, an organic group having 1 to 10 carbon atoms, hydroxy, or carboxy, with the proviso that when a is 0, at least one of them is a group having an alicyclic structure; q is an integer of 1 or above; and X is-O-,-NHCO-,-CONH-,-COO-, or-OCO-.
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