| 摘要 |
<p>1,143,531. Semi-conductor devices; printed circuit assemblies. PHOTOCIRCUITS CORP. 19 Jan., 1966 [19 Jan., 1965], No. 2403/66. Headings H1K and H1R. A solid state device having conductive terminal lands at an edge is mounted on an insulating support through which extend conductive terminal pins which are arranged in the same pattern as and closely adjacent to the terminal lands to which they are bonded by masking the support and device to expose the terminal pins and lands, and depositing conductive material through the mask. As shown, Fig. 3, a solid state device 13, which may be an integrated circuit is provided with semicircular terminal pads 14 to 23 of copper at the edges of one major face, each of the pads being connected to a region of the device by a conductive track. The device is mounted with the terminal pads uppermost on an insulating substrate (not shown) of glass or plastics from which project semicircular terminal pins 11, of copper or nickel-copper, arranged so that each pin is close to, and in register with, one of the terminal pads. A mask having circular or elliptical apertures is placed over the assembly, the exposed surfaces are cleaned by ion bombardment, and copper is vacuum-deposited to form a conductive layer bonding each terminal pad to the adjacent terminal pin. A plurality of solid-state devices may be mounted on a single insulating substrate, the terminal pins being interconnected by a multilayer network. The mounted solidstate devices may be encapsulated or enclosed by a cover. The multilayer interconnection network may be produced by forming a first layer of printed circuit conductors on the insulating support, forming a photo-sensitive insulating layer over the conductors and photo-chemically processing this layer to expose terminal regions and forming a second layer of printed circuit conductors over the insulating layer selectively connected to the conductors of the first layer at the terminal regions.</p> |
