| 摘要 |
<P>PROBLEM TO BE SOLVED: To cleanse a surface of a wafer polishing plate used for polishing a semiconductor wafer at high cleansing degree and high efficiency. <P>SOLUTION: A wafer polishing plate P after wafer polishing is rotatably held by a plate rotating roller 12 in a cleansing tank 11, and a cleansing liquid pressurized by a high pressure injection pump 21 is made into an injection cleansing liquid 15 by a nozzle 14, so that it is injected to a wafer holding face 13, on which a groove part M is formed, so as to remove adhered wax or solid polishing agent. Simultaneously, the wafer holding face 13 is abraded by a plate surface brush cleansing mechanism 25. Also, each portion is abraded using a plate side brush cleansing mechanism 27 and a plate rear face brush cleansing mechanism 28, so as to remove deposits. The cleansing liquid is refluxed in a cleansing liquid reflux tank 19 by a cleansing liquid circulating pump 17, heated to an appropriate temperature by a cleansing liquid heating heater 20, and circulated and supplied. <P>COPYRIGHT: (C)2008,JPO&INPIT |
