| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive composition superior in sensitivity, resolution, electroless gold plating resistance and preservation stability and efficiently forming a highly minutely permanent pattern (protection film, interlayer insulation film, solder resist pattern and the like) by combination of a prescribed binder and an amid compound, and to provide a photosensitive film, a photosensitive laminate, a permanent pattern-forming method using the photosensitive laminate, and a printed circuit board for forming a permanent pattern by the permanent pattern-forming method. <P>SOLUTION: The photosensitive composition contains a binder, a polymerization compound, a photo polymerization initiator, a thermal cross-linking agent, and an amid compound. In the photosensitive composition, the photosensitive film and the photosensitive laminate, the binder contains a polymer compound having an aromatic group that can contain a hetero ring at a chain side and an ethylene unsaturated coupling. In addition, the permanent pattern-forming method using the photosensitive laminate and the printed circuit board forming the permanent pattern by the permanent pattern-forming method are provided. <P>COPYRIGHT: (C)2008,JPO&INPIT |
