| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a mounting method of flip-chip connecting a semiconductor chip and a substrate via an underfill material, and thermosetting the underfill material after inspection for checking operation. <P>SOLUTION: The mounting method of a bumped semiconductor chip or a package includes steps of placing a thermally flowable and thermosetting underfill material film between the bumped semiconductor chip and the substrate, temporarily making electrical connection by applying heat and pressure at a temperature and pressure enough for the underfill material film to flow, and making inspection for checking operation. The method includes steps of further heating when the inspection is successful for thermosetting the film to obtain a final electronic machine, or removing a defective chip or package with the temperature enough for the film to flow if the inspection is not successful, and thereafter repeating the above steps with a new bumped chip or package. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
