| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable resin composition having heat-releasing property useful e.g. for a resin insulation layer of a package substrate or a surface mounted light-emitting diode and having excellent storage stability. SOLUTION: The curable resin composition contains (A) a copolymer resin containing carboxyl group, (B) a compound having≥2 reactive groups curable with actinic energy ray, (C) a photopolymerization initiator and (D) ceramic particles radiating far infrared rays. The amount of the ceramic particles (D) radiating far infrared rays in the solid component of the composition is≥60 vol.%. COPYRIGHT: (C)2008,JPO&INPIT |
