发明名称 ISOLATING CHIP-TO-CHIP CONTACT
摘要 An apparatus has two slabs of substrate material joined to each other, the two slabs including a pair of contacts joined to each other having a shape separating a first area from a second area.
申请公布号 US2007228576(A1) 申请公布日期 2007.10.04
申请号 US20060422551 申请日期 2006.06.06
申请人 发明人 TREZZA JOHN
分类号 H01L21/00;H01L29/40 主分类号 H01L21/00
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