Preparing epoxide resin, useful as base material to prepare printed circuit boards and printed circuits, comprises reacting resin with polyfunctional aldehyde or ketone, and reacting the obtained compound with phosphinic acid derivative

摘要

Preparation of halogen free, epoxide resin containing flame solid material, comprises reacting the epoxide resin with a polyfunctional aldehyde or ketone, and reacting the obtained compound with a phosphinic acid derivative, where the phosphinic acid derivative contains at least a P-H active structural unit (a), and an equivalent quantity of the polyfunctional aldehyde or ketone is used in the reaction. Preparation of halogen free, epoxide resin containing flame solid material, comprises reacting the epoxide resin with a polyfunctional aldehyde or ketone, and reacting the obtained compound with a phosphinic acid derivative, where the phosphinic acid derivative contains at least a P-H active structural unit (a) of formula (=PH(O)), and an equivalent quantity of the polyfunctional aldehyde or ketone is used in the reaction. An independent claim is included for halogen free, epoxide resin with flame solid material, obtained by the above process.