| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyamide resin composition having a combination of high transparency and heat resistance enough to be usable even at high-temperature atmosphere. SOLUTION: The polyamide resin composition comprises a total of 100 pts.wt. of (a) 85-99.5 pts.wt. of a copolyamide resin giving a 1mm-thick molded form with overall light transmittance of 80% or greater and (b) 0.5-15 pts.wt. of a swelling layered silicate containing organic onium ions and a hindered amine compound. COPYRIGHT: (C)2008,JPO&INPIT
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