发明名称 |
Semiconductor or sensor arrangement for use in soldered housing, has surfaces soldered in region and connected with board in another region, where former region lying proximate at structure to be contacted is thicker than latter region |
摘要 |
<p>The arrangement has contact surfaces (2), which are not holohedrally soldered, where the contact surfaces are firmly soldered with a section of a conductive strip (5) in a surface region (7) and are not firmly connected with a printed circuit board in a surface region (10). The surface region (7) lying at a semiconductor or sensor structure to be contacted is thicker than the surface region (10), which is not connected with the printed circuit board.</p> |
申请公布号 |
DE102006015222(A1) |
申请公布日期 |
2007.10.04 |
申请号 |
DE20061015222 |
申请日期 |
2006.03.30 |
申请人 |
ROBERT BOSCH GMBH |
发明人 |
DOERING, ANTON;MUELLER, STEFAN;HAAG, FRIEDER;GAHN, CHRISTOPH |
分类号 |
H01L23/50 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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