发明名称 PATTERN FORMING MATERIAL, PATTERN FORMING METHOD, AND PRINTED BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a pattern forming material capable of obtaining high sensitivity and a satisfactory resist pattern shape, superior in insulation reliability, and capable forming a high-definition pattern, and to provide a pattern forming method employing the same and a printed board on which a permanent pattern is formed by the pattern forming method. <P>SOLUTION: The pattern forming material includes a photosensitive layer formed by using a photosensitive composition at least including a binder, a polymerizable compound, and a photopolymerization initiator, wherein absorption at 810 cm<SP>-1</SP>per 1 &mu;m thickness of the pattern formed by at least exposing the photosensitive layer after the photosensitive layer is stacked on the surface of the board is <0.02. The pattern forming method employing the pattern forming material and the printed board on which the permanent pattern is formed by the pattern forming method are provided. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007256855(A) 申请公布日期 2007.10.04
申请号 JP20060084200 申请日期 2006.03.24
申请人 FUJIFILM CORP 发明人 IKEDA TAKAMI;KANAYAMA SHUJI
分类号 G03F7/027;G03F7/004;G03F7/20;G03F7/26;H01L21/027;H05K3/00;H05K3/28 主分类号 G03F7/027
代理机构 代理人
主权项
地址