发明名称 LAMINATED ELECTRONIC COMPONENT, AND MANUFACTURING METHOD THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To provide a laminated electronic component wherein it can be baked in a reduction atmosphere, and its capacitance temperature characteristic is excellent, and further, its DC bias characteristic is good, and furthermore, the amount of its electrostriction is reduced, and moreover, it has its improved high-temperature-accelerated lifetime and the reduced variation thereof. <P>SOLUTION: The laminated electronic component has dielectric layers and inner electrodes, and each dielectric layer contains as its main components BaTiO<SB>3</SB>, SrTiO<SB>3</SB>, and CaTiO<SB>3</SB>, and also, BaTiO<SB>3</SB>, SrTiO<SB>3</SB>, and CaTiO<SB>3</SB>are not soluble in each other solidly substantially. Further, they are contained in the form of a plurality of crystal grains of BaTiO<SB>3</SB>, SrTiO<SB>3</SB>, and CaTiO<SB>3</SB>. Furthermore, each dielectric layer comprises a dielectric ceramic composition forming a composite structure. Moreover, in the electrode-contacted grains of the ones which are contacted directly with each inner electrode layer in each dielectric layer, the ratio of the number of the CaTiO<SB>3</SB>crystal grains to the total number of the BaTiO<SB>3</SB>, SrTiO<SB>3</SB>, and CaTiO<SB>3</SB>crystal grains is 50-80%. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007258474(A) 申请公布日期 2007.10.04
申请号 JP20060081408 申请日期 2006.03.23
申请人 TDK CORP 发明人 MIYAUCHI MARI;TAKANO HIROSUKE;SATO AKIRA
分类号 H01G4/12;C04B35/46;H01G4/30 主分类号 H01G4/12
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