| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a working method and a device for a workpiece where, even in the case the workpiece is thick, the workpiece can be efficiently and securely cleaved, and further, even in the case the workpiece is a semiconductor wafer, there is no risk of breaking an electronic circuit formed on the surface of the semiconductor wafer, and the generation of debris can be suppressed as well. <P>SOLUTION: The hybrid working device 1 is provided with a supporting means 4 supporting a workpiece 3 and moved to an XY direction in the horizontal plane; and a working head 2 injecting a liquid column W of high pressure water toward the workpiece 3 on the supporting means 4, and further transmitting laser light L into the liquid column W, so as to be emitted. At first, the liquid column W is injected to the cleavage scheduled line of the workpiece 3 from the working head 2, further, the laser light L transmitted into the liquid column W is emitted to the workpiece, and a continuous groove is formed in such a manner that the cleavage scheduled line may be traced. Thereafter, the liquid column W is injected from the working head 2 to the groove, thus the workpiece 3 is cleaved as the cleavage scheduled line. In this way, cleavage can be efficiently and securely performed even in the case the workpiece 3 is thick. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
