| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer piece peeling method capable of efficiently peeling individual wafer pieces of a disc-like wafer which adheres and is held on a supporting sheet and diced and divided into wafer pieces, from the supporting sheet. SOLUTION: The wafer peeling method is provided with a step of preparing sheets 10a, 10b with a wafer which have sheets 11, 30 each having an adhesive force and wafers 20a, 20b each adhering and held on the sheet; and a step of peeling wafer pieces from each of the sheets. In the step of peeling the wafer pieces from the sheet, an adhesive holding force of the sheet for only one wafer piece on the wafer is reduced while operating a suction device 46 provided away from the wafer on the wafer side of the sheet with a wafer. Thus, the wafer pieces are peeled off from the sheet and sucked by the sucking device. COPYRIGHT: (C)2008,JPO&INPIT |
