| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor capable of measuring electrical property of a device single body without being affected by another device loaded on the semiconductor device. SOLUTION: The semiconductor device separates an analog switch and bleeder resistors electrically from each other on a semiconductor substrate, and electrically connectable pads are provided at the respective ends of them. In the case of measuring the electrical property at a wafer level, the electrical property is measured through the pad, so that the electrical property as the device single body to be measured is measured without being affected by another device. After measuring the electrical property at the wafer level, the respective pads are connected with each other by wire bonding to form a circuit. COPYRIGHT: (C)2008,JPO&INPIT |
