发明名称 JOINT EVALUATION METHOD AND JOINT EVALUATION DEVICE
摘要 PROBLEM TO BE SOLVED: To precisely perform the reliable judgment of accelerated life with respect to a solder joint part by a simple method. SOLUTION: The joint evaluation device is equipped with a cooling part 12 and a heating part 13 both of which repeatedly perform heating and cooling with respect to a solder joint part 8, a measuring circuit part 11 and a measuring part 22 both of which measure the resistance value of the solder joint part 8 at a predetermined cycle during hot supply, an arithmetic part 23 for calculating a resistance change ratio and the change speed of the resistance change ratio from the resistance value at each time when the resistance value is measured, a judge part 24 for judging whether the resistance value reaches an inflection point, where the lowering of the change speed of the resistance change ratio is started, from the calculated change speed of the resistance change ratio, an evaluation part 25 for starting the evaluation related to the reliability of the solder joint part 8 by comparing the resistance change ratio with a preset reference threshold value and an information part 3 for reporting that the resistance change ratio exceeds the preset reference threshold value. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007255925(A) 申请公布日期 2007.10.04
申请号 JP20060077224 申请日期 2006.03.20
申请人 ESPEC CORP 发明人 AOKI YUICHI
分类号 G01N27/20;B23K1/00;B23K101/42;H05K3/34 主分类号 G01N27/20
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