| 摘要 |
A method for fabricating a chip package structure is disclosed. One or plural patterned plates are used to fabricate the inner circuits and the outer circuits, and some fabricating steps can be proceeded repeatedly to form a stack structure, and after a protective layer is formed, the carrier is removed. Using the plate as a mask to fabricate the circuits can enhance the yield and simplify the fabricating processes of the package. Further, the removed carrier can be recycled to reduce the production cost.
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