| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a position measuring method and a device capable of measuring highly accurately position information of an object without causing decline in the throughput, and to provide a device manufacturing method that uses the method. <P>SOLUTION: First, correlation between an image signal acquired by imaging a measuring object domain R1 on the object, such as a wafer and the first template signal determined beforehand, is sought, and a first position information of the object is sought. Then, a second template signal used for the position measurement of a measuring object region R2 is generated based on a signal acquired by imaging the inside of the measuring object region R1. Thereafter, the correlation between a second signal acquired by imaging the inside of the measuring object region R2 and the second template signal is sought, and a second position information of the object is sought. <P>COPYRIGHT: (C)2008,JPO&INPIT |
