| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an inspection method of wafer chuck, capable of inspecting it a state of being installed in a device. <P>SOLUTION: In this inspecting method, a wafer chuck 31 for sucking and holding a semiconductor wafer on its upper surface is inspected. A predetermined test wafer W2 is mounted on the upper surface of the wafer chuck 31, an optical flat 40 is superimposed and mounted on the upper surface of the test wafer W2, and defects in the upper surface of the wafer chuck 31 is detected, based on the variation from the predetermined state of an interference pattern appearing in the optical flat 40 superimposed and mounted on the upper surface of the test wafer W2. When the defects in the upper surface of the wafer chuck 31 are detected by using the optical flat 40, a part where variation in the interference pattern has been generated on the upper surface of the wafer chuck 31 is observed with a microscope. <P>COPYRIGHT: (C)2008,JPO&INPIT |
