| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component attaching method and an electronic component attaching device which attach an electronic component to a printed board only when flux transferred to a projecting electrode of the electronic component is proper. <P>SOLUTION: The standard diameter of projecting electrodes 28 of a BGA (ball grid array) 27 and the dispersion α of diameters of the projecting electrodes 28 are stored in a RAM 62. Then, the flux is transferred to the projecting electrode 28 of the BGA 27 that is taken out of a component feeder 16 by a suction nozzle 24. A recognition processor 19 recognizes and processes an image of the projecting electrode 28 of the BGA 27 with the transferred flux, the image is captured by a component recognition camera 21, and a CPU 60 calculates the diameter of the projecting electrode 28 with the transferred flux on the basis of a recognition process result from the recognition processor 19. A calculation result from the CPU 60 is stored in the RAM 62, and the CPU 60 compares the diameter of the projecting electrode 28 after the flux is transferred with the sum of the standard diameter and the dispersion α. Based on a result of the comparison, the CPU judges on whether or not to attach the BGA 27 held on the suction nozzle 24 to the printed board 18. <P>COPYRIGHT: (C)2008,JPO&INPIT |
