| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a camera module and a manufacturing method thereof, and a printed circuit board for the camera module with a plating line in its the inner layer. <P>SOLUTION: The manufacturing method of the camera module comprises: a step to form a printed circuit board where a plating line is formed in the inner layer and wiring patterns are formed at least on the top layer (S101); a step to connect the plating line in the inner layer and the patterns to a layer connecting part (S105); a step to form a pattern protection layer in the area excluding a plating pattern from the wiring patterns on the top layer (S107); a step to form a plated layer on the surface of the plating patterns by connecting an electrode to the plating line (S109); a step to mount an image sensor to the printed circuit board (S111); and a step to join a housing with a lens on the printed circuit board (S113). <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
