| 摘要 |
PROBLEM TO BE SOLVED: To improve the uniformity of plasma treatment situation in the surface of a wafer and in wafers each other. SOLUTION: Electrode bodies 50 equipped with a perforated electrode plate 51, a sheet type electrode plate 52, and a dielectric body 53 in a holder 46 of a boat 43 are constructed corresponding to the wafers 1 on respective stages. The perforated electrode plate 51 and the sheet type electrode plate 52 are surrounded by the dielectric body 53 with a predetermined space. The electrode body 50 is arranged so that the sheet-type electrode plate 52 is faced to the active area side of the wafer 1. An AC power supply 61 for impressing AC power is connected between the perforated electrode plate 51 and the sheet-type electrode plate 52 of the electrode body 50 in parallel through an impedance matching box 62. An insulating transformer 63 is interposed on the way of a route for supplying the AC power. Uniform and flat plasma 54, produced by creeping discharge, is produced at the active area side of the wafer for the electrode body 50 to apply uniform plasma treatment to the main surface at the active area side of the wafer 1. COPYRIGHT: (C)2008,JPO&INPIT
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