| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive for semiconductors that can be formed into B stages quickly by the irradiation of light, to provide a semiconductor device using the adhesive, and to provide a manufacturing method of the semiconductor device. SOLUTION: The adhesive for semiconductors contains a radical polymerizable monomer, a compound for generating radicals by the irradiation of light, a thermosetting resin, and a curing agent for curing the thermosetting resin. The ratio of the radical polymerizable monomer to the total of the radical polymerizable monomer, the thermosetting resin, and the curing agent is 50 wt.% or higher and 85 wt.% or smaller. COPYRIGHT: (C)2008,JPO&INPIT
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