| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and a substrate processing method which can prevent sufficiently the poor processing of a substrate while reducing sufficiently the manufacturing cost of the substrate. SOLUTION: In the outward of a spin chuck 21, a cleaning pot 210 corresponding to a chemical nozzle 50 and a pot 220 for predispensing are provided. After chemical processing of a substrate W; the chemical nozzle 50 is held in the cleaning pot 210, and its front end is cleaned by a cleaning liquid. The cleaning liquid used for the cleaning is recovered by the cleaning pot 210 and disposed of as waste fluid through a waste fluid pipe 211a. When in predispensing, the chemical nozzle 50 is held in the pot 220 for predispensing and discharges a predetermined amount of chemical. The discharged chemical is sent to a circulating system pipe arrangement 120A through a recovery pipe 221a. The chemical is, after stored in a recovery tank RTA once, sent to a chemical reservoir tank TA and stored. The stored chemical is sent again to the chemical nozzle 50. COPYRIGHT: (C)2008,JPO&INPIT
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