发明名称 |
METHOD AND APPARATUS FOR REPAIRING WIRE OF CIRCUIT BOARD |
摘要 |
PROBLEM TO BE SOLVED: To provide a method capable of easily repairing a wire of a wiring board by means of atmospheric plasma treatment. SOLUTION: Fine metallic particles are supplied to a wire defective part of a circuit board to be repaired. Plasma gas from an atmospheric plasma generator employing oxidation gas as plasma generation gas is blown to the supplied particles. The blowing of the plasma gas applies annealing treatment to the metallic particles to integrate the particles with a wire. COPYRIGHT: (C)2008,JPO&INPIT
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申请公布号 |
JP2007258213(A) |
申请公布日期 |
2007.10.04 |
申请号 |
JP20060076738 |
申请日期 |
2006.03.20 |
申请人 |
MICRONICS JAPAN CO LTD |
发明人 |
IKEDA MASATO;TANAKA KATSUMI |
分类号 |
H01L21/3205;G09F9/00;H01L21/283;H01L23/52;H05K3/24 |
主分类号 |
H01L21/3205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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