发明名称 METHOD AND APPARATUS FOR REPAIRING WIRE OF CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a method capable of easily repairing a wire of a wiring board by means of atmospheric plasma treatment. SOLUTION: Fine metallic particles are supplied to a wire defective part of a circuit board to be repaired. Plasma gas from an atmospheric plasma generator employing oxidation gas as plasma generation gas is blown to the supplied particles. The blowing of the plasma gas applies annealing treatment to the metallic particles to integrate the particles with a wire. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007258213(A) 申请公布日期 2007.10.04
申请号 JP20060076738 申请日期 2006.03.20
申请人 MICRONICS JAPAN CO LTD 发明人 IKEDA MASATO;TANAKA KATSUMI
分类号 H01L21/3205;G09F9/00;H01L21/283;H01L23/52;H05K3/24 主分类号 H01L21/3205
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