发明名称 CONDUCTIVE PARTICLES, ADHESIVE COMPOSITION, CIRCUIT CONNECTION MATERIAL AND CONNECTION STRUCTURE, AS WELL AS CONNECTION METHOD OF CIRCUIT MEMBER
摘要 PROBLEM TO BE SOLVED: To provide conductive particles capable of achieving for both a low enough initial resistance value of a connection part and excellent insulation property between adjacent circuit electrodes, and sufficiently restraining temporary rise of a resistance value of the connection part when circuit members with fine circuit electrodes are connected respectively, and to provide an adhesive composition and a circuit connection material using this, a connection structure with circuit members connected, as well as a connection method of the circuit members. SOLUTION: This conductive particles are equipped with nuclear particles having conductivity and an insulation coating containing an organic polymer compound provided on a surface of the nuclear particles, and a coverage ratio defined in a formula (1) is in a range from 20 to 40%. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007258141(A) 申请公布日期 2007.10.04
申请号 JP20060183619 申请日期 2006.07.03
申请人 HITACHI CHEM CO LTD 发明人 TANAKA MASARU;TAKETAZU JUN
分类号 H01B5/00;C09J9/02;C09J11/00;C09J201/00;H01B1/20;H05K3/32 主分类号 H01B5/00
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