发明名称 |
CONDUCTIVE PARTICLES, ADHESIVE COMPOSITION, CIRCUIT CONNECTION MATERIAL AND CONNECTION STRUCTURE, AS WELL AS CONNECTION METHOD OF CIRCUIT MEMBER |
摘要 |
PROBLEM TO BE SOLVED: To provide conductive particles capable of achieving for both a low enough initial resistance value of a connection part and excellent insulation property between adjacent circuit electrodes, and sufficiently restraining temporary rise of a resistance value of the connection part when circuit members with fine circuit electrodes are connected respectively, and to provide an adhesive composition and a circuit connection material using this, a connection structure with circuit members connected, as well as a connection method of the circuit members. SOLUTION: This conductive particles are equipped with nuclear particles having conductivity and an insulation coating containing an organic polymer compound provided on a surface of the nuclear particles, and a coverage ratio defined in a formula (1) is in a range from 20 to 40%. COPYRIGHT: (C)2008,JPO&INPIT
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申请公布号 |
JP2007258141(A) |
申请公布日期 |
2007.10.04 |
申请号 |
JP20060183619 |
申请日期 |
2006.07.03 |
申请人 |
HITACHI CHEM CO LTD |
发明人 |
TANAKA MASARU;TAKETAZU JUN |
分类号 |
H01B5/00;C09J9/02;C09J11/00;C09J201/00;H01B1/20;H05K3/32 |
主分类号 |
H01B5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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