发明名称 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
摘要 PROBLEM TO BE SOLVED: To favorably dry the surface of a substrate while preventing the occurrence of collapse of a pattern formed on the substrate surface in drying the substrate surface wetted with a liquid. SOLUTION: An opposite surface 31 of an adjacent block 3 is disposed close to the substrate surface Wf, the adjacent block 3 is moved in the state of forming a liquid-tight layer 23 in a gap space SP between the opposite surface 31 and the substrate surface Wf in the moving direction (-X), and solvent gas containing a solvent component dissolved in a liquid to lower the surface tension is supplied toward the upstream end 231 of the liquid-tight layer 23. Further, the liquid is supplied toward the substrate surface Wf on the upstream side interface 231a of the liquid-tight layer 23 or on the downstream side (-X) in the moving direction from the upstream side interface 231a and displaced by fresh liquid to which a rinse liquid (a liquid) coming into contact with the substrate surface Wf is additionally supplied. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007255752(A) 申请公布日期 2007.10.04
申请号 JP20060078228 申请日期 2006.03.22
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 MIYA KATSUHIKO
分类号 F26B21/14;B08B3/02;H01L21/304 主分类号 F26B21/14
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